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Patent Searching and Data


Title:
表面パネルおよびその製造方法
Document Type and Number:
Japanese Patent JP5090553
Kind Code:
B2
Abstract:
A method manufactures a front panel including a front panel body formed of a single transmissive resin layer and a sensor film attached thereto, using a first mold having a molding recessed portion and a second mold having a molding projecting portion. The first and second molds are joined together such that a cavity is formed between the molding recessed portion and the molding projecting portion, by placing the sensor film between the first mold and the second mold, on the molding projecting portion in the cavity. A melted resin is injected into the cavity to form the single transmissive resin layer having a front surface formed in a shape of the molding recessed portion, and a back surface formed along the sensor film in a shape of the molding projecting portion, thereby laminating the sensor film to the back surface of the transmissive resin layer.

Inventors:
Kitano Sadao
Shinji Okawara
Kazutono
Tokuda Mitsuru
Application Number:
JP2011075459A
Publication Date:
December 05, 2012
Filing Date:
March 30, 2011
Export Citation:
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Assignee:
ALPS ELECTRIC CO.,LTD.
International Classes:
G06F3/041; H01H11/00; H01H13/00; H01H13/04
Domestic Patent References:
JP2010244772A
JP2005339856A
JP2007072902A
Attorney, Agent or Firm:
野▲崎▼ 照夫
Masayoshi Miwa