Title:
SURFACE POLISHING METHOD UTILIZING MECHANICAL AND CHEMICAL REACTION
Document Type and Number:
Japanese Patent JP04315569
Kind Code:
A
Abstract:
PURPOSE: To develop a metal surface polishing method capable of contributing high speed vacuum attainability and super vacuum attainability to a closed space surrounded with the surface to be polished.
CONSTITUTION: In this surface polishing method utilizing mechanical and chemical reaction, by pressing a carrier stuck with mixture constituted by dispersing and mixing abrasive grains in an organic medium containing organic acid against a metal surface and polishing the surface, an adhesive gas quantity on the polishing surface to be worked is decreased, and the metal surface capable of decreasing emission gas in a vacuum territory is formed.
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Inventors:
Ikeda, Hidemitsu
Application Number:
JP1991000103580
Publication Date:
November 06, 1992
Filing Date:
April 10, 1991
Export Citation:
Assignee:
SOKEN KOGYO KK
International Classes:
B24B37/00; (IPC1-7): B24B37/00
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