Title:
SURFACE PREPARATION AGENT FOR COPPER AND COPPER ALLOY, AND USE THEREOF
Document Type and Number:
Japanese Patent JP2015054987
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface preparation agent and a surface preparation method capable of forming a film excellent in oxidation resistance and corrosion resistance on the surface of copper or a copper alloy and enhancing stability in use and water repellency of the film, and to provide an electronic part and a print circuit board having the film formed on the surface of copper or a copper alloy by bringing into contact with the surface preparation agent, and a transparent electrode substrate obtained by sticking the print circuit board with an insulator layer using a transparent adhesive and a touch panel equipped with the transparent electrode substrate.SOLUTION: A surface preparation agent contains a tetrazole compound and/or its salt, a pH buffer, and ammonia. The ratio of the ammonia contained in the agent is higher than an equimole relative to the tetrazole compound and its salt.
Inventors:
IIDA SOSAKU
TASAKA ATSUSHI
MURAI TAKAYUKI
HIRAO HIROHIKO
TASAKA ATSUSHI
MURAI TAKAYUKI
HIRAO HIROHIKO
Application Number:
JP2013188614A
Publication Date:
March 23, 2015
Filing Date:
September 11, 2013
Export Citation:
Assignee:
SHIKOKU CHEM
International Classes:
C23C22/63; H05K3/28
Attorney, Agent or Firm:
Yuriko Hamada
古館 Kuniko
Tomoko Yamazaki
古館 Kuniko
Tomoko Yamazaki