SURFACE QUALITY MEASUREMENT SYSTEM, SURFACE QUALITY MEASUREMENT METHOD, POLISHING DEVICE AND POLISHING METHOD

Japanese Patent JP2023162110

A

To provide a surface quality measurement system which can accurately measure the surface quality of a polishing pad without damaging the polishing pad and reducing the throughput of the entire polishing processing.SOLUTION: A surface quality measurement system 40 comprises: an optical measurement device 41 which irradiates a polishing surface 2a of a rotating polishing pad 2 with light and measures the surface quality of the polishing pad 2 on the basis of reflection light from the polishing surface 2a; a cover member 44 which is arranged between the optical measurement device 41 and the polishing pad 2; and a transparent liquid supply line 45 which is connected to an injection port 44b provided in the cover member 44 and supplies transparent liquid onto the polishing pad 2 through the injection port 44b. The cover member 44 includes a light transmission part 44a on an optical path of light and reflection light.SELECTED DRAWING: Figure 9

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KANEUMA TOSHIFUMI
OSHIMA KOHEI
OTA KOHEI

JP2023009590A

November 08, 2023

January 25, 2023

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EBARA CORP

B24B37/10; B24B49/12; B24B37/20; B24B49/18; B24B53/017; B24B53/12; G01B11/00; H01L21/304

Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa

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