To provide a surface roughening method for copper foil with which the consumption of an anode electrode is reduced even in roughening treatment at a high current density, the roughening treatment can easily be performed at a high current density, and a fine, roughened plating film capable of corresponding to fine patterning or high frequency can be obtained.
In the surface roughening method for copper foil, at the time when plating is performed with copper foil 1 located on a position opposed to an anode electrode 2 as a cathode in a plating liquid 4, and a roughening treatment layer formed from a projecting electrodeposition is formed on the surface of the copper foil 1, the area of the copper foil 1 dipped into the plating liquid 4 is controlled to 1/5 to 4/5 of the area of the anode electrode 2.
SASAKI HAJIME
KODAIRA MUNEO
