Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2023009305
Kind Code:
A
Abstract:
To provide a surface-treated copper foil and a copper-clad laminate that have an excellent adhesion to an insulation base material and that can form a circuit pattern of high etching factor suitable for fine pitching.SOLUTION: There is provided a surface-treated copper foil 1 having a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of the surface-treated copper foil 1 has an average length AR of a roughness motif based on JIS B0631: 2000 of 6 to 20 μm. Further, a copper-clad laminate 10 includes the surface-treated copper foil 1 and an insulation base material 11 bonded to the first surface-treated layer 3 of the surface-treated copper foil 1.SELECTED DRAWING: Figure 1
Inventors:
Nobuaki Miyamoto
Atsushi Miki
Atsushi Miki
Application Number:
JP2022185265A
Publication Date:
January 19, 2023
Filing Date:
November 18, 2022
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D7/06; C25D5/12; C25D5/16; C25D5/48
Attorney, Agent or Firm:
Axis International Patent Attorney Corporation