Title:
表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
Document Type and Number:
Japanese Patent JP6543001
Kind Code:
B2
Abstract:
A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 μm or more and 0.30 μm or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.
Inventors:
Takeo Uno
Yuko Okuno
Takahiro Tsuruta
Yoshimasa Nishi
Fukutake honest
Yuko Okuno
Takahiro Tsuruta
Yoshimasa Nishi
Fukutake honest
Application Number:
JP2018540888A
Publication Date:
July 10, 2019
Filing Date:
March 29, 2018
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
MURATA MANUFACTURING CO.,LTD.
MURATA MANUFACTURING CO.,LTD.
International Classes:
C25D7/06; B32B15/08; C25D5/16; H05K1/03; H05K1/09
Domestic Patent References:
| JP2015147978A | ||||
| JP2018141228A | ||||
| JP2018141229A | ||||
| JP2018145519A |
Foreign References:
| WO2014196576A1 | ||||
| WO2016035876A1 | ||||
| WO2016117587A1 | ||||
| WO2017026490A1 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Shuichi Sumiyoshi