Title:
表面処理銅箔、その表面処理銅箔を用いて得られる銅張積層板及びプリント配線板
Document Type and Number:
Japanese Patent JP6722452
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a surface-processed copper foil with which there is very little variation in the adherence of the surface-processed copper foil and an insulating resin substrate which constitute a printed wiring board. To achieve this purpose, provided is a surface-processed copper foil on which roughening has been carried out on the electrode surface side of an electrolytic copper foil, wherein the surface-processed copper foil is characterized by having a roughened surface which satisfies the conditions indicated by a formula 1. Also provided are a copper clad laminate characterized by being obtained by using the surface-processed copper foil, and a printed wiring board characterized by being obtained by using the copper clad laminate.
Inventors:
Shinichi Kobata
Shinya Hiraoka
Shinya Hiraoka
Application Number:
JP2015515307A
Publication Date:
July 15, 2020
Filing Date:
September 02, 2014
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D1/04; C25D7/00; H05K1/09
Domestic Patent References:
| JP2004256910A | ||||
| JP2008226800A | ||||
| JP8158100A | ||||
| JP2013133514A | ||||
| JP2004152904A | ||||
| JP10330983A |
Foreign References:
| WO2005049895A1 | ||||
| WO2013002279A1 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura