Title:
表面処理銅箔および銅クラッドラミネート
Document Type and Number:
Japanese Patent JP7324320
Kind Code:
B2
Abstract:
A surface-treated copper foil includes a bulk copper foil and a first surface treatment layer. The first surface treatment layer is disposed on a first surface of the bulk copper foil and includes a roughening layer, where the outermost surface of the first surface treatment layer is a treating surface of the surface-treated copper foil. The material volume (Vm) of the treating surface is 0.06 to 1.45 μm3/μm2, and the five-point peak height (S5p) of the treating surface is 0.15 to 2.00 μm.
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Inventors:
▲黄▼ 建銘
▲頼▼ 耀生
Zhou Rui Chang
▲頼▼ 耀生
Zhou Rui Chang
Application Number:
JP2022003164A
Publication Date:
August 09, 2023
Filing Date:
January 12, 2022
Export Citation:
Assignee:
Changchun Petroleum Chemical Co., Ltd.
International Classes:
H05K3/38; C25D1/04; C25D5/10; C25D5/16; C25D7/06; H05K1/03
Domestic Patent References:
JP2020143364A | ||||
JP2017036495A | ||||
JP2014139336A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Osamu Miyazaki
Tadahiko Ito
Osamu Miyazaki