Title:
銅箔付き高速プリント回路基板製品用の表面処理銅箔及び製造方法
Document Type and Number:
Japanese Patent JP6723338
Kind Code:
B2
Abstract:
Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.
Inventors:
Yoyoi
Zheng Katsura
Zhou Ruichang
Zheng Katsura
Zhou Ruichang
Application Number:
JP2018247473A
Publication Date:
July 15, 2020
Filing Date:
December 28, 2018
Export Citation:
Assignee:
Changchun Petroleum Chemical Co., Ltd.
International Classes:
C25D7/06; C25D1/00; C25D1/04; C25D5/16; H05K1/09
Domestic Patent References:
| JP2016010961A | ||||
| JP2016204747A |
Foreign References:
| WO2013147116A1 | ||||
| WO2015040998A1 |
Other References:
中村暁史他,「射出成形品内面への回路形成を目指した透過レーザ光による回路描画」,生産研究[online],2006年11月15日,58巻2号,125頁-128頁
Attorney, Agent or Firm:
Patent corporation ssinpat