Title:
表面処理銅箔、その製造方法、これを含む銅箔積層板、およびこれを含むプリント配線板
Document Type and Number:
Japanese Patent JP7064563
Kind Code:
B2
Abstract:
Provided are: a surface-treated copper foil including a surface-treated layer formed on at least one side of an untreated copper foil and an oxidation preventing layer formed on the surface-treated layer, wherein the surface-treated layer contains copper particles having an average particle diameter of about 10 nm to about 100 nm and has a 10-point average roughness, Rz, of about 0.2 μm to about 0.5 μm and a gloss (Gs 60°) of about 200 or more, and the oxidation preventing layer contains nickel (Ni) and phosphorus (P); a manufacturing method thereof; a copper foil laminate including the same; and a printed wiring board including the same.
Inventors:
Yoon Sang Hwa
Yuan Chang Yoru
Seo Jung Woo
Ryu Young Ho
Song Kitok
Choi Woong
Pom Won Chin
Kim Hyun Chul
Yuan Chang Yoru
Seo Jung Woo
Ryu Young Ho
Song Kitok
Choi Woong
Pom Won Chin
Kim Hyun Chul
Application Number:
JP2020208110A
Publication Date:
May 10, 2022
Filing Date:
December 16, 2020
Export Citation:
Assignee:
ILJIN MATERIALS CO., LTD.
International Classes:
C25D7/06; B32B7/023; B32B15/01; B32B15/08; B32B15/20; B32B27/06; C25D3/38; C25D5/12; C25D5/16
Domestic Patent References:
| JP2015061934A | ||||
| JP2018141229A | ||||
| JP6248231B1 | ||||
| JP2005206915A | ||||
| JP2019525006A |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Naonori Koda
Satoshi Deno
Masatoshi Takahashi
Shinji Mihashi
Naonori Koda
Satoshi Deno
Masatoshi Takahashi
Previous Patent: Sealed refrigerant compressor and freezing / refrigerating equipment using it
Next Patent: air purifier
Next Patent: air purifier