SURFACE-TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WIRING BOARD, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

Japanese Patent JP2015110843

A

PROBLEM TO BE SOLVED: To provide a surface-treated copper foil and a laminate using the copper foil, having good adhesiveness to a resin, excellent transparency of the resin after the copper foil is removed by etching, and a low transmission loss of signals.SOLUTION: The surface-treated copper foil satisfies the following conditions. (1) A root-mean-square R1 on one surface S of the foil is 0.14 to 0.63 μm; (2) a ten-point average roughness Rz of the other surface is 0.35 μm or more; (3) an observation point-brightness graph, which is obtained by laminating the copper foil on the S side to both surfaces of a polyimide resin substrate, removing the copper foils by etching, laying a printed matter having a printed line mark under the exposed polyimide substrate, and taking a picture of the mark through the polyimide substrate by a CCD camera, satisfies a predetermined formula; and (4) a deposition amount of Ni and/or Co on the S side surface is a predetermined amount or less.

FUKUCHI RYO
NAGAURA YUTA
ARAI EITA
MIKI ATSUSHI
ARAI YASUNORI
NAKAMURO KAICHIRO

JP2015012824A

June 18, 2015

January 26, 2015

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JX NIPPON MINING & METALS CORP

C25D7/06; C25D1/04; C25D5/12; H05K1/09; H05K3/42

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