Title:
SURFACE-TREATED COPPER FOIL AND LAMINATE, PRINTED WIRING BOARD AND ELECTRONIC APPARATUS USING THE SAME, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2015117436
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treated copper foil, which can be well bonded to a resin and has excellent transparency of the resin after the copper foil is removed by etching; and a laminate using the same.SOLUTION: The copper foil surface except for a roughening treated surface S of a surface-treated copper foil has a 10-point average roughness Rz of 0.35 μm or more. In a brightness curve, Bt represents the top average, Bb represents the bottom average, and ΔB(ΔB=Bt-Bb) represents the difference between the top average Bt and the bottom average Bb. In an observation spot versus brightness graph, t1 represents a value indicating the position of the intersection closest to the linear mark among the intersections of the brightness curve and Bt, and t2 represents a value indicating the position of the intersection closest to the linear mark among the intersections of the brightness curve and 0.1ΔB in the range from the intersection of the brightness curve and Bt to a depth of 0.1ΔB with Bt as reference. Sv defined by the following expression (1) is 3.5 or more: Sv=(ΔB×0.1)/(t1-t2) (1)
Inventors:
FUKUCHI RYO
NAGAURA YUTA
ARAI EITA
MIKI ATSUSHI
ARAI YASUNORI
NAKAMURO KAICHIRO
NAGAURA YUTA
ARAI EITA
MIKI ATSUSHI
ARAI YASUNORI
NAKAMURO KAICHIRO
Application Number:
JP2015012815A
Publication Date:
June 25, 2015
Filing Date:
January 26, 2015
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; C25D1/04; C25D5/16; H05K1/09; H05K3/38; H05K3/46
Domestic Patent References:
| JP2014141737A | 2014-08-07 | |||
| JP2014111817A | 2014-06-19 | |||
| JP2014111815A | 2014-06-19 | |||
| JP2014166225A | 2014-09-11 | |||
| JP2014141736A | 2014-08-07 | |||
| JP2014111824A | 2014-06-19 | |||
| JP2014111277A | 2014-06-19 | |||
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Attorney, Agent or Firm:
Axis International Patent Business Corporation