Title:
SURFACE-TREATED COPPER FOIL AND LAMINATED BOARD USING THE SAME, COPPER FOIL, PRINTED WIRING BOARD, ELECTRONIC APPARATUS AND METHOD FOR PRODUCING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2014177712
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treated copper foil which suitably adheres to a resin and is excellent in transparency of a resin after removing the copper foil by etching, and to provide a laminated board using the same.SOLUTION: There is provided a surface-treated copper foil in which roughening particles containing copper are formed by roughening treatment on a copper foil surface, and a polyimide resin substrate has a haze value of 20 to 70% when the cooper foil is bonded to both surfaces of the polyimide resin substrate having a thickness of 50 μm from the roughening treatment surface side and then the copper foil on both surfaces is removed by etching.
Inventors:
ARAI EITA
MIKI ATSUSHI
MIKI ATSUSHI
Application Number:
JP2014125803A
Publication Date:
September 25, 2014
Filing Date:
June 18, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; C25D5/12; C25D7/00; H05K1/09; H05K3/38
Attorney, Agent or Firm:
Axis international patent business corporation