To provide a surface treated copper foil laminated with a liquid crystal polymer film having low hygroscopicity and superior high thermal resistance to make a circuit board composite materials having large peel strength and compatibility with fine pattern processes.

The copper foil is deposited with roughening particles to make the copper foil having a roughened surface, wherein the surface roughness Rz is 1.5 to 4.0 m and luminosity is not more than 30. Projections formed from the roughening particles have a height of 1 to 5 m, and preferably 6 to 35 thereof are uniformly distributed in a range of a 25 m cross-section observed. The maximum width of each projection is 0.01 m and not more than twice of length obtained by dividing 25 m by the number of projections present in a range of the 25 m.