Title:
SURFACE TREATED COPPER FOIL, SURFACE TREATED COPPER FOIL WITH RESIN LAYER, COPPER FOIL WITH CARRIER, LAMINATE, MANUFACTURING METHOD FOR CIRCUIT BOARD, AND MANUFACTURING METHOD FOR ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2022169670
Kind Code:
A
Abstract:
To provide a surface-treated copper foil in which exfoliation of roughened particles in a roughened particle layer arranged on a surface of the copper foil is well suppressed and occurrence of a wrinkle and a stripe when plying-up with an insulation substrate is well suppressed.SOLUTION: A surface-treated copper foil has a copper foil and a roughened processed layer on at least one surface of the copper foil. The roughened processed layer meets one or more selected from the following groups (1) to (6): (1) Roughness Sq ranges from 0.16 μm to 0.30 μm, inclusive; (2) Roughness Ssk ranges from -0.6 to -0.35, inclusive; (3) Roughness Sa ranges from 0.12 μm to 0.23 μm, inclusive; (4) Roughness Sz ranges from 2.20 μm to 3.50 μm, inclusive; (5) Roughness Sku ranges from 3.75 to 4.50, inclusive; and (6) Roughness Spk ranges from 0.13 μm to 0.27 μm, inclusive. The color difference ΔE*ab according to JIS Z8730 of a surface of the roughened processed layer side is smaller than or equal to 65, and the glossiness of the surface of the roughened processed layer side is smaller than or equal to 70%..SELECTED DRAWING: Figure 1
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Inventors:
Yuki Dali
Eita Arai
Atsushi Miki
Ryo Fukuchi
Eita Arai
Atsushi Miki
Ryo Fukuchi
Application Number:
JP2022131233A
Publication Date:
November 09, 2022
Filing Date:
August 19, 2022
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D5/16; B32B3/30; B32B15/20; C25D1/04; C25D5/48; C25D7/06
Domestic Patent References:
| JP2015117436A | 2015-06-25 | |||
| JP2017106092A | 2017-06-15 | |||
| JP2016084528A | 2016-05-19 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation