To provide a surface-treated copper foil which does not contain chrome in a surface-treated layer, and is excellent in peel strength of a circuit and in deterioration rate of the chemical resistance of the peel strength after having been formed into a printed circuit board.

The surface-treated copper foil has a surface-treated layer provided on a surface to be laminated of the copper foil which is used for producing a copper-clad laminate by laminating the copper foil with an insulative resin substrate. The surface-treated copper foil is characteristically provided with the surface-treated layer obtained by depositing a high-melting point metal component having a melting point of 1,400C by a dry film deposition method on the surface to be laminated of a cleanup-treated copper foil, and further depositing a carbon component.