To provide a surface treated electrolytic copper foil which has a low profile on an equal or higher level as compared with a low-profile surface treated electrolytic copper foil which has been supplied on the conventional market and is small in waviness which affects the linearity of wiring, and to provide a process for producing the surface treated electrolytic copper foil.
In the surface treated electrolytic copper foil, on the face of adhesion to an insulating layer constituent material, the maximum level difference of elevation of waviness (Wmax) is 0.05 μm to 0.7 μm, the maximum difference of elevation of irregularities (PV) is 0.05 to 1.5 μm, and the surface roughness (Rzjis) is 0.1 μm to 1.0 μm. The electrolytic copper foil used in the production of the surface treated electrolytic copper foil is produced by electrolysis under electrolytic conditions of current density on at least two different levels from continuous first step electrolysis to nth step electrolysis, using a sulfuric acid-based copper electrolysis solution, prepared by adding 3-mercapto-1-propanesulfonic acid or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine, and by using a cathode having a small surface roughness.
MATSUDA MITSUYOSHI
TOMONAGA SAKIKO
SAKAI HISAO
SAKATA TOMOHIRO
YOSHIOKA ATSUSHI
NISHIKAWA SUSUMU
TAGUCHI TAKEO
| JP2004263296A | 2004-09-24 | |||
| JP2004263289A | 2004-09-24 | |||
| JP2005015861A | 2005-01-20 | |||
| JPS502378B1 | 1975-01-25 |
| WO2003096776A1 | 2003-11-20 |
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