Title:
SURFACE-TREATED SILICA POWDER AND MANUFACTURING METHOD OF THE SAME, RESIN COMPOSITION AND DISPERSION
Document Type and Number:
Japanese Patent JP2022162370
Kind Code:
A
Abstract:
To provide surface-treated silica powder with excellent filling properties when used as a resin filler such as a semiconductor sealant.SOLUTION: Provided is a surface-treated silica powder having an epoxy group on a surface in which a ratio (E2/E1) is 0.5 or more, the ratio of an epoxy group amount E1 (pieces/nm2) of the surface of the surface-treated silica powder to an epoxy group amount E2 (pieces/nm2) on a surface of cleaned powder vacuum-dried for 1 hour after repeating three times a process of dispersing a 3 mass% ethanol suspension of the surface-treated silica powder for 10 minutes by an ultrasonic disperser having an output power of 110 W and performing solid-liquid separation by a centrifuge.SELECTED DRAWING: None
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Inventors:
WATANABE SATOSHI
SAEKI KEIJI
KIGUCHI MASAHIDE
SAEKI KEIJI
KIGUCHI MASAHIDE
Application Number:
JP2021067181A
Publication Date:
October 24, 2022
Filing Date:
April 12, 2021
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
C01B33/18; C08K9/06; C08L101/00; C09C1/28; C09C3/12; C09D17/00