Title:
SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, MANUFACTURING METHOD OF SUBSTRATE, MANUFACTURING METHOD OF PRINTED WIRING BOARD, MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF COPPER CLAD LAMINATE SHEET
Document Type and Number:
Japanese Patent JP2017172048
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treated copper foil capable of providing a profile shape of a substrate surface after removal of a copper foil, maintaining fine wiring formation properties and achieving good adhesion force of a non-electrolytic copper plating film.SOLUTION: The surface treated copper foil is adhered to a resin substrate for a printed wiring board from the surface treated layer side, and when the surface treated copper foil is removed, the black area ratio of the surface of the resin substrate from which the copper foil has been removed is 10 to 50%, in addition, the average diameter of holes in the surface of the resin substrate from which the copper foil has been removed is 0.03 to 1.0 μm.SELECTED DRAWING: Figure 3
Inventors:
ISHII MASASHI
HONDA MISATO
MIYAMOTO NOBUAKI
HONDA MISATO
MIYAMOTO NOBUAKI
Application Number:
JP2017113835A
Publication Date:
September 28, 2017
Filing Date:
June 08, 2017
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C25D7/06; B32B15/20; C25D1/04; C25D5/12; C25D5/16; H05K1/03; H05K1/09
Domestic Patent References:
| JP5204908B1 | 2013-06-05 | |||
| JP2009148962A | 2009-07-09 | |||
| JPS60164392A | 1985-08-27 | |||
| JPH08330709A | 1996-12-13 | |||
| JP2002204049A | 2002-07-19 |
Foreign References:
| WO2012043182A1 | 2012-04-05 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation