Surface treatment copper foil, copper foil with a career, a manufacturing method of a printed circuit board, a manufacturing method of a copper-clad laminate sheet, and a manufacturing method of a printed wired board

Title:

Document Type and Number:

Japanese Patent JP6178360

Kind Code:

B2

More Like This:

JP4698957	Electrolytic copper foil and electrolytic polishing method for glossy surface of electrolytic copper foil
WO/2014/006781	ULTRATHIN COPPER FOIL, METHOD FOR PRODUCING SAME, AND ULTRATHIN COPPER LAYER

Inventors:

Nobuaki Miyamoto
Shinichi Sasaki
Masashi Ishii

Application Number:

JP2015096953A

Publication Date:

August 09, 2017

Filing Date:

May 11, 2015

Export Citation:

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Assignee:

JX Nippon Mining & Metals Co., Ltd.

International Classes:

C25D7/06; B32B15/08; C23F1/18; C25D1/04; H05K1/09

Domestic Patent References:

JP2012246567A
JP2002506121A
JP2005254673A
JP940933A
JP2008140902A
JP2003158364A
JP2012255180A
JP2011219790A
JP2006210689A
JP2002161394A
JP200269691A
JP9195096A

Foreign References:

WO2013136729A1
WO2008149772A1

Attorney, Agent or Firm:

Axis International Patent Business Corporation

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