Title:
Surface treatment copper foil, copper foil with a career, the manufacturing method of a substrate, a manufacturing method of a printed wired board, a manufacturing method of a printed circuit board, a manufacturing method of a copper-clad laminate sheet
Document Type and Number:
Japanese Patent JP6254306
Kind Code:
B2
Inventors:
Masashi Ishii
Misato Honda
Nobuaki Miyamoto
Misato Honda
Nobuaki Miyamoto
Application Number:
JP2017000790A
Publication Date:
December 27, 2017
Filing Date:
January 05, 2017
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D5/16; B32B15/01; B32B15/04; B32B15/08; C25D1/04; C25D7/06; H05K3/20; H05K3/38
Domestic Patent References:
| JP2011040728A | ||||
| JP1194391A | ||||
| JP2012109526A | ||||
| JP2015042765A | ||||
| JP2011040727A |
Foreign References:
| WO2010093009A1 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation