Title:
SURFACE-TREATED COPPER FOIL
Document Type and Number:
Japanese Patent JP2017122274
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-treated copper foil excellent in adhesion to an insulation substrate at room temperature, and capable of suppressing generation of blister, when applying a heat load of solder reflow by constituting a copper-clad laminate.SOLUTION: There is provided a surface-treated copper foil having a surface-treated face. In the surface-treated copper foil, one or more of following conditions is satisfied, which are determined by XPS measurement at a depth after 0.5 min sputtering under a condition of rate 1.1 nm/min (in terms of SiO) from the surface-treated face: (1) an N concentration is 1.5-7.5 atom%, (2) a C concentration is 12-30 atom%, (3) an Si concentration is 3.1 atom% or more, and an O concentration is 40-48 atom%.SELECTED DRAWING: None
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Inventors:
MIKI ATSUSHI
FUKUCHI RYO
ARAI EITA
FUKUCHI RYO
ARAI EITA
Application Number:
JP2016230684A
Publication Date:
July 13, 2017
Filing Date:
November 28, 2016
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C23C28/00; B32B15/04; C23C22/24; H05K1/03; H05K1/09
Domestic Patent References:
| JP2006123425A | 2006-05-18 | |||
| JP2004244710A | 2004-09-02 |
Foreign References:
| WO2013147116A1 | 2013-10-03 | |||
| WO2013147115A1 | 2013-10-03 | |||
| WO2016174970A1 | 2016-11-03 | |||
| US20040161627A1 | 2004-08-19 | |||
| CN104246013A | 2014-12-24 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation