Title:
Surface treatment copper foil
Document Type and Number:
Japanese Patent JP6190846
Kind Code:
B2
Abstract:
This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 μg/dm2, and the amount of adhesion of N on the copper foil surface is from 2.5 to 690 μg/dm2. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.
Inventors:
Ryo Fukuchi
Application Number:
JP2015095252A
Publication Date:
August 30, 2017
Filing Date:
May 07, 2015
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
B32B15/01; C23C28/00; B32B15/08; C23C22/24; C25D1/04; C25D5/10; C25D5/12; C25D7/06; H05K1/09
Attorney, Agent or Firm:
Axis International Patent Business Corporation