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Patent Searching and Data


Title:
SURFACE TREATMENT OF COPPER
Document Type and Number:
Japanese Patent JPH0637446
Kind Code:
A
Abstract:

PURPOSE: To provide a method of treating a copper surface to form a uniform layer capable of reliable adhesion to resin.

CONSTITUTION: A copper surface is treated by oxidation, reduction and nickel plating to enhance its adhesion to resin and prevent haloing. The individual treatment steps are controlled while the potential of the copper surface is monitored. Each step is finished when the surface potential reaches a predetermined level. To this end, a potentiometer 10 is provided for each bath 11 so that it may be connected between a substrate 9 and an electrode 13 when the substrate is immersed in the bath containing a solution 12. This arrangement enables control of different conditions of chemical solution for different treatments by monitoring the respective surface potentials during oxidation, reduction and plating. Therefore, it is possible to carried out uniform treatment of a copper surface.


Inventors:
Kagiwada, Hikari
Furukawa, Kiyonori
Nohara, Shozo
Application Number:
JP1992000190918
Publication Date:
February 10, 1994
Filing Date:
July 17, 1992
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H05K3/38; H05K3/46; (IPC1-7): H05K3/38; H05K3/46
Attorney, Agent or Firm:
武 顕次郎