Title:
SURFACE TREATMENT METAL POWDER, CONDUCTIVE PASTE USING SAME, AND PRINTED WIRING BOARD AND CHIP COMPONENTS OBTAINED BY USING CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2005190907
Kind Code:
A
Abstract:
To provide metal powder with which conductive paste doing without a viscosity adjustment as far as possible can be obtained and the conductive paste.
A surface treatment layer that surface treatment metal powder is equipped with on the powder surface is formed of an organic compound having both an acid radical and a base. The organic compound having the both acid radical and base has an acid number within the range of 10(KOHmg/g) to 110(KOHmg/g), and an amine value within the range of 15(KOHmg/g) to 150(KOHmg/g).
Inventors:
SAKAGAMI TAKAHIKO
YOSHIMARU KATSUHIKO
YOSHIMARU KATSUHIKO
Application Number:
JP2003433054A
Publication Date:
July 14, 2005
Filing Date:
December 26, 2003
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO
International Classes:
C09C1/62; B22F1/02; C09C3/10; H01B1/22; H01B5/00; H05K3/12; (IPC1-7): H01B5/00; B22F1/02; C09C1/62; C09C3/10; H01B1/22; H05K3/12
Domestic Patent References:
| JPH117830A | 1999-01-12 | |||
| JP2002115001A | 2002-04-19 | |||
| JP2000290573A | 2000-10-17 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura