PURPOSE: To effectively prevent a plasticizer from migrating from the surface of a molding to other substances, by crosslinking the surface of a vinyl chloride resin molding containing the plasticizer with a specific crosslinking compound and an organic peroxide.

CONSTITUTION: A vinyl chloride resin molding containing a plasticizer is dipped in or coated with a crosslinking compound with at least two or more double bonds per one molecule and an organic peroxide and then heat-treated to form a high- density crosslinked layer on the surface of the vinyl chloride resin molding, whereby preventing the migration of the plasticizer. The crosslinking compound used includes ethylene glycol dimethacrylate, divinyl ether, etc., and the organic peroxide used includes di-sec-butylperoxydicarbonate, cyclohexanone peroxide, etc., having a one-minute half-life temperature of 90W260°C.