Title:
SWAGING APPARATUS
Document Type and Number:
Japanese Patent JP2012045619
Kind Code:
A
Abstract:
To provide a swaging apparatus that absorbs load exceeding a setting value between a rod of a drive part and a collet of a driven part for smoothing a swaging step.
The swaging apparatus includes: a collet housing used for a can swaging step of linearly narrowing an opening after inserting an electrode assembly into a can having the opening which is expanded from a straight line in a tapered shape; a collet for swaging the opening of the can inserted into the collet housing in an axial direction; a buffer part built in the collet housing, which is connected to the collet in the axial direction; and a rod connected to the buffer part at an opposite side to the collet in the axial direction, which transfers swaging load.
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Inventors:
CHA JUNG-BAE
JUNG JAE HO
HA KYUNG-DOO
JUNG JAE HO
HA KYUNG-DOO
Application Number:
JP2010251598A
Publication Date:
March 08, 2012
Filing Date:
November 10, 2010
Export Citation:
Assignee:
SAMSUNG SDI CO LTD
International Classes:
B21D19/10; B21D19/08; B21D41/04; B21D51/26; H01M2/02
Domestic Patent References:
| JPS63138938U | 1988-09-13 | |||
| JPS5584645A | 1980-06-26 | |||
| JPH06215792A | 1994-08-05 | |||
| JP2004330288A | 2004-11-25 | |||
| JP2003071600A | 2003-03-11 | |||
| JPS63138938U | 1988-09-13 |
Attorney, Agent or Firm:
Takashi Watanabe
Yasuhiko Murayama
Yasuhiko Murayama