To provide a switch mechanism capable of making the whole of electronic components thin.

This switch mechanism is equipped with a substrate 45 (40) provided with a switch contact pattern 49, an elastic pressure plate 55 having a base portion 56 made of elastic metal plate and attached on the substrate 45 (40) and an arm portion 57 projecting out from the base portion 56, and a rotating object 60 provided with abutting portions 65 (67) on a bottom surface thereof. By moving the rotating object 60, the abutting portions 65 (67) abuts on and presses down the arm portion 57, and a pressing portion 58 at a tip end portion of the arm portion 57 presses the switch contact pattern 49 to turn on a switch. An attaching surface of the switch mechanism to the substrate 45 (40) that is made by an elastic pressing plate 55 and the like is made to be lower than the other surface of the substrate 45 (40).