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Title:
スイッチ
Document Type and Number:
Japanese Patent JP5146205
Kind Code:
B2
Abstract:
A plurality of vertical bends are provided in a terminal projecting from a switch contact outwardly of a case. With this structure, when the terminal is soldered to a land on a wiring board, a plurality of solder layers are formed between the plurality of bends and the land. The plurality of solder layers can enhance the terminal strength, thereby preventing the switch from coming or floating off from the wiring board. Thus, a switch capable of ensuring reliable operation can be provided.

Inventors:
Anfuku Kenji
Kenji Nishimura
Application Number:
JP2008223111A
Publication Date:
February 20, 2013
Filing Date:
September 01, 2008
Export Citation:
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Assignee:
Panasonic Corporation
International Classes:
H01H9/02; H01H15/02; H01H21/12
Domestic Patent References:
JP2005340061A
JP2143723U
JP2008218357A
JP485542U
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii



 
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