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Patent Searching and Data


Title:
SYNTHETIC RESIN ABRASIVE
Document Type and Number:
Japanese Patent JPH036285
Kind Code:
A
Abstract:

PURPOSE: To obtain an abrasive which has improved impact resistance and can effectively remove resin flash without impairing the appearance of a molded article, etc., by the suspension polymerization of an unsaturated polyester resin in an aqueous medium in the presence of a rubbery polymer.

CONSTITUTION: An unsaturated dibasic acid and a glycol compound are esterified to give an unsaturated ester, which is then dissolved in a polymerizable vinyl monomer. A rubbery polymer is sufficiently dispersed in this solution, and the dispersion is made to undergo suspension polymerization in an aqueous medium in the presence of a polymerization initiator to five a slurry containing spherical polyester resin. This slurry is filtered to give a synthetic resin abrasive. The abrasive thus obtained can effectively remove resin flash from a molded article to give molded material almost free from surface roughening.


Inventors:
KORENAGA OSAMU
WATABE KATSUSHI
OISHI IWAO
Application Number:
JP13916189A
Publication Date:
January 11, 1991
Filing Date:
June 02, 1989
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
B24C11/00; C08F283/01; C08F299/04; C08L67/06; C09K3/14; H01L21/56; (IPC1-7): B24C11/00; C08F299/04; C08L67/06; C09K3/14; H01L21/56