SYRUP COMPOSITION, CURED MATERIAL OF IT, AND COATING METHOD

Title:

SYRUP COMPOSITION, CURED MATERIAL OF IT, AND COATING METHOD

Document Type and Number:

Japanese Patent JP2009161589

Kind Code:

A

Abstract:

To provide a syrup composition having low viscosity to allow easy coating work, producing a cured material with high strength, and exhibiting excellent durability under high temperature conditions.

The syrup composition contains 100 pts.mass of syrup (X) and 0.1-5 pts.mass of a wax (C). The syrup (X) comprises 60-80 mass% of an acrylic monomer (A) and 20-40 mass% of a polymer (B) having a butyl methacrylate unit or an isobornyl (meth)acrylate unit and having a double bond.

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Inventors:

AOKI TOSHIICHI
TAKASU MIKIO
SHIMA KAZUYOSHI
YOSHII YUJIRO

Application Number:

JP2007339746A

Publication Date:

July 23, 2009

Filing Date:

December 28, 2007

Export Citation:

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Assignee:

MITSUBISHI RAYON CO

International Classes:

C08F290/12; C09D5/02; C09D5/33; C09D133/00; C09D191/06

Domestic Patent References:

JPH10245422A	1998-09-14
JPH07162116A	1995-06-23
JP2002020440A	2002-01-23
JP2001002957A	2001-01-09
JP2007010885A	2007-01-18
JP2002114830A	2002-04-16

Attorney, Agent or Firm:

Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama

Previous Patent: JP2009161588

Next Patent: METHOD FOR PRODUCING PROPYLENE-BASED POLYMER AND PROPYLENE-BASED POLYMER