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Title:
SYSTEM FOR DELIVERING MATERIAL ONTO SUBSTRATE
Document Type and Number:
Japanese Patent JP2005131639
Kind Code:
A
Abstract:

To provide a system for delivering a material onto a substrate capable of manufacturing an electronic circuit in a simple and effective manner.

The system comprises a jetting system having a reservoir 102 containing the material 104 and including a nozzle 108 through which the material is expelled from the reservoir, an arcuate section 110 disposed between the reservoir and the nozzle and so configured that the material travels from the reservoir to the nozzle 108 through the arcuate section, a means 112 for applying pressure on the material contained in the reservoir, wherein the material is expelled from the reservoir through application of pressure on the material to thereby create a column 118 of the material from the nozzle 108, and a means 122 for producing pressure modulation configured to regulate formation of droplets from the column of the material. The system further comprises a charging ring 126 so configured as to induce an electrical charge to selected ones of the droplets, and one or more deflection plates 128 for altering a trajectory of the charged droplets.


Inventors:
YANG CHUNG C
GIBSON GARY
Application Number:
JP2004315573A
Publication Date:
May 26, 2005
Filing Date:
October 29, 2004
Export Citation:
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Assignee:
HEWLETT PACKARD DEVELOPMENT CO
International Classes:
B05D1/04; B05C5/00; B05D3/00; B41J2/02; B41J2/07; B41J2/09; H05K3/12; (IPC1-7): B05C5/00; B05D1/04; B05D3/00
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura