To provide a system for inspecting the insertion of substrates, without power on in substrate insertion inspection, when slave substrates are inserted in master substrate.

Two short-circuit pins of each slave substrate to be inspected are used as a terminal for resistance value measurement, as a means of inspecting insertion without power on. Existing short-circuit pins, such as power pins or GND pins are used for terminals for resistance value measurement of child substrates so that there is no need for altering the slave substrates. After the insertion of the slave substrates in a parent substrate, wiring for insertion inspection is installed over the master substrate via the terminal for resistance value measurement of each slave substrate to measure resistance values via the wiring for insertion inspection. When the resistance values do not match the prescribed values, it is determined that there are insertion mistakes.