Title:
SYSTEM AND METHOD FOR EXPOSURE PROCESSING
Document Type and Number:
Japanese Patent JP2005197362
Kind Code:
A
Abstract:
To provide an exposure processing system which easily prevents the size variation in a wafer plane between a plurality of wafers.
The exposure processing system comprises a coat developer 13 having a plurality of hot plate units and a plurality of developer units, an aligner 14, and a controller 22 for controlling the aligner 14 so as to expose a wafer under process, using correcting data for correcting the size variation of a resist pattern in a wafer plane caused by a paired heater unit-developer unit used for the wafer under process among a plurality of paired heater unit-developer units.
Inventors:
KONO TAKUYA
KOMINE NOBUHIRO
TOUKI TATSUHIKO
HARAKAWA SHOICHI
IKEDA MAKOTO
KOMINE NOBUHIRO
TOUKI TATSUHIKO
HARAKAWA SHOICHI
IKEDA MAKOTO
Application Number:
JP2004000515A
Publication Date:
July 21, 2005
Filing Date:
January 05, 2004
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
G03C1/492; G03C1/494; G03C1/76; G03F7/30; G03C5/00; G03F7/20; G03F9/00; G03G15/08; G21K5/00; H01L21/00; H01L21/027; (IPC1-7): H01L21/027; G03F7/20; G03F7/30
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Sadao Muramatsu
Ryo Hashimoto