To provide a system and a method for manufacturing a copper material with a high specific surface area.
The system for manufacturing the copper material with the high specific surface area includes: a heating device 110 for heating and melting a solid copper material; a drainage device 120 enabling a copper molten liquid to flow out through an opening at the bottom by the gravity; and a cooling device 130 for cooling and solidifying the copper molten liquid flown out through the opening at the bottom of the drainage device to form the copper material with the high specific surface area. The manufacturing method therefor includes: a step of forming a copper molten liquid by heating and melting a solid copper material; a step of passing the copper molten liquid through an opening at the bottom of a drainage device by the gravity; and a step of cooling and solidifying the copper molten liquid flowing out through the opening at the bottom of the drainage device to be formed into the copper material with the high specific surface area. The copper material with the high specific surface area has an excellent solubility in a copper sulfate solution, is suitable for application of a copper plating process as a supply origin of copper ions, and can improve a copper plating effect in the overall plating system.
CHEN CHAU-SHING
CHO EISHIN
KA MEISEI
SHU ZUISHO
O SHUNDAN
| JP2005008930A | 2005-01-13 | |||
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