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Title:
SYSTEM AND METHOD FOR PRODUCING MULTI-LAYERED BOARD HAVING CORRUGATED MEDIUM ARTICLE AND EMBOSSED MEDIUM ARTICLE
Document Type and Number:
Japanese Patent JP2023174799
Kind Code:
A
Abstract:
To provide a system and method for producing a multi-layered board having a corrugated medium article and an embossed medium article.SOLUTION: There is provided a system and method for producing a board product having at least one corrugated medium article and at least one embossed medium article in the board product. The board product may further include one or more facings that are adhesively coupled to either the corrugated medium article and/or the embossed medium article. Generally, the corrugated medium article may be characterized as a paper product having grooves introduced by a cross-direction corrugating process such that the introduced grooves are perpendicular to (or at least not congruent with) a machine direction of the paper product. The embossed medium article may be characterized as a paper product having grooves introduced by a vertical embossing process such that the introduced grooves are aligned in the machine direction of the paper product. A resultant board product is stronger and more efficiently produced because a vertically-embossed medium article takes advantage of a natural strength of the paper in the machine direction.SELECTED DRAWING: Figure 1

Inventors:
GILES GREENFIELD
Application Number:
JP2023176097A
Publication Date:
December 08, 2023
Filing Date:
October 11, 2023
Export Citation:
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Assignee:
PACKAGING ACQUISITIONS I LTD
International Classes:
B31F1/24
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mihashi
Junichi Tsuruta
Tomohiro Minamiyama
Yuichi Morimoto
Youichi Watanabe
Kazuhiro Nakamura