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Patent Searching and Data


Title:
SYSTEM, METHOD AND PROGRAM FOR CREATING DIE LAYOUT
Document Type and Number:
Japanese Patent JP2013169596
Kind Code:
A
Abstract:

To perform a die selection process, a bending process, and a die layout process related to a bridging die layout by using an automation means.

A system 1 for creating a die layout is used for creating a die layout of a bending machine 6. In a bridging die situation, an automation means to virtually perform a die selection process, a bending process, and a die layout process is provided, and the automation means performs a process according to a predetermined algorithm. The predetermined algorithm selects a bridging die in the die selection process, performs the die layout process in the bridging die, includes a process of determining whether there is interference between a workpiece W and an intermediate plate CP, and pursues a subsequent process when a bending sequence suitable for actual work is present.


Inventors:
OMURA TAKESHI
Application Number:
JP2012037194A
Publication Date:
September 02, 2013
Filing Date:
February 23, 2012
Export Citation:
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Assignee:
AMADA CO LTD
International Classes:
B21D5/02
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu