Title:
真空含浸のためのシステム及び方法
Document Type and Number:
Japanese Patent JP2023514674
Kind Code:
A
Abstract:
部品を真空にさらし、部品をポリマー含浸液に浸漬し、部品に陽圧を加えて部品の間隙にポリマー含浸液を入り込ませ、圧力を大気圧に解放し、好ましくは活性重合工程無しでポリマー含浸液を固化させる、真空含浸システム及びプロセス。
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Inventors:
Irvine, Daniel Bee.
Kozak, William Gee.
Kozak, William Gee.
Application Number:
JP2022543111A
Publication Date:
April 07, 2023
Filing Date:
January 12, 2021
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
B05C3/02; B05D1/18
Attorney, Agent or Firm:
Katsuhiro Ito
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