Title:
金属材料を製造するためのシステム及び金属材料の製造方法
Document Type and Number:
Japanese Patent JP6936265
Kind Code:
B2
Abstract:
The purpose of the invention is to provide a means for identifying factors leading to the occurrence of bumps on the surface of a metal plate in electrolytic refining. The present invention relates to a system for manufacturing a metal material through electrolytic refining, said system comprising: an imaging unit configured to capture an image of the surface of a metal plate; a position detection unit configured to obtain position information in an electrolytic cell when the metal plate is present in the electrolytic cell; an image processing unit configured to extract, from imaging data, features related to bumps generated on the surface of the metal plate; and a storage unit configured to store the position information and the features related to the bumps.
Inventors:
Kunio Watanabe
Takeshi Guri
Tsuyoshi Shikada
Satoshi Nagao
Takeshi Guri
Tsuyoshi Shikada
Satoshi Nagao
Application Number:
JP2019047638A
Publication Date:
September 15, 2021
Filing Date:
March 14, 2019
Export Citation:
Assignee:
Pan Pacific Copper Co., Ltd.
International Classes:
C25C7/00; C25C1/12; G01N33/2045; G06T7/00; G06T7/64
Domestic Patent References:
| JP2013181911A | ||||
| JP2010122225A | ||||
| JP11092984A | ||||
| JP2002012996A | ||||
| JP2015105429A | ||||
| JP2009167532A | ||||
| JP2012038005A | ||||
| JP9258390A | ||||
| JP2011185638A | ||||
| JP2013111671A | ||||
| JP2001056297A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation