Title:
デバイスに関連付けられたオーバーレイの計測のためのシステムおよび方法
Document Type and Number:
Japanese Patent JP7118152
Kind Code:
B2
Abstract:
An overlay metrology system may measure a first-layer pattern placement distance between a pattern of device features and a pattern of reference features on a first layer of an overlay target on a sample. The system may further measure, subsequent to fabricating a second layer including at least the pattern of device features and the pattern of reference features, a second-layer pattern placement distance between the pattern of device features and the pattern of reference features on the second layer. The system may further measure a reference overlay based on relative positions of the pattern of reference features on the first layer and the second layer. The system may further determine a device-relevant overlay for the pattern of device-scale features by adjusting the reference overlay with a difference between the first-layer pattern placement distance and the second-layer pattern placement distance.
Inventors:
Rasuke Frank
Paulman Ulrich
Eyring Stephan
Gutmann Nadav
Paulman Ulrich
Eyring Stephan
Gutmann Nadav
Application Number:
JP2020531119A
Publication Date:
August 15, 2022
Filing Date:
December 06, 2018
Export Citation:
Assignee:
KLA Corporation
International Classes:
G03F7/20; H01L21/66
Domestic Patent References:
| JP2009510770A | ||||
| JP2013534368A | ||||
| JP2017040941A |
Foreign References:
| US20050068515 |
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office