Title:
ワイヤ束を処理するためのシステム及び方法
Document Type and Number:
Japanese Patent JP7075728
Kind Code:
B2
Abstract:
A wire processing system (100) includes a tray having at least one tray surface (378) configured to sequentially receive a first wire (200) and a second wire (204) from a wire feed system (106) of a wire processing machine (102). The tray surface (378) has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface (378) and the first wire (200) higher than a wire-to-wire coefficient of friction between the first wire (200) and the second wire (204) laying on top of the first wire (200). The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire (200) relative to the tray surface (378) during movement of the second wire (204) relative to the first wire (200).
Inventors:
Eric Jay Helmic
Bradley Jay Mitchell
Nick S. Evans
Damian Oh Martin
Affair Ansonton
Bradley Jay Mitchell
Nick S. Evans
Damian Oh Martin
Affair Ansonton
Application Number:
JP2017118005A
Publication Date:
May 26, 2022
Filing Date:
June 15, 2017
Export Citation:
Assignee:
The Boeing Company
International Classes:
H01B13/012
Domestic Patent References:
| JP8018252A |
Attorney, Agent or Firm:
Usui Nao
Minoru Yoshida
Tatsuya Tanaka
Suzuki Yasumitsu
Shintaro Suzuki
Keita Kobuchi
Tomokazu Saito
Minoru Yoshida
Tatsuya Tanaka
Suzuki Yasumitsu
Shintaro Suzuki
Keita Kobuchi
Tomokazu Saito
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