Title:
電子部品の熱管理のためのシステムおよび方法
Document Type and Number:
Japanese Patent JP2014505319
Kind Code:
A
Abstract:
The device for extracting heat from carbon nanotubes wires or cables used under high power applications is provided. The device can include a thermally conductive member for placement against a heat source and for directing heat away from the heat source to a heat dissipating medium. The device can further include an electrically conductive member positioned on the thermally conductive member and made from a layer of carbon nanotubes, to reduce electrical resistance along the electrically conductive member. A geometric pattern can be imparted to the electrically conductive member to enhance dissipation of heat away from the thermally conductive member and the heat source.
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Inventors:
Brian white
Craig Lombard
David S. Rushmore
Craig Lombard
David S. Rushmore
Application Number:
JP2013538947A
Publication Date:
February 27, 2014
Filing Date:
November 11, 2011
Export Citation:
Assignee:
Nanocomp Technologies, Inc.
International Classes:
H01B7/42; H01B11/18
Domestic Patent References:
| JP2009057249A | 2009-03-19 | |||
| JP2005116839A | 2005-04-28 | |||
| JP2012010583A | 2012-01-12 |
Foreign References:
| US20080001284A1 | 2008-01-03 | |||
| US20100000754A1 | 2010-01-07 |
Attorney, Agent or Firm:
Samejima Mutsumi
Kyousei Tamura
Keiichi
Norihito Yamao
Kyousei Tamura
Keiichi
Norihito Yamao