To lighten, thin and downsize a TCP structure for laminating an IC chip, thereby achieving a light, thin and compact semiconductor package.

The TCP structure 10 has a frame shape having an opening 6 in its center, and a structure with a die-attach agent layer 5, a polyimide insulating layer 1, a conductive layer 2 with a wiring circuit and an input/output terminal formed, and a solder resist layer 3, laminated in this order. The thickness of the die-attach agent layer 5 is 5 to 25 μm, the thickness of the polyimide insulating layer 1 is 10 to 40 μm, the thickness of the conductive layer 2 is 5 to 15 μm. The thickness of the solder resist layer 3 is 5 to 20 μm as a laminate for laminating IC chip, and the thickness of the TCP structure 10 for laminating the IC chip is formed in conformity to the thickness of the IC chip 11.

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