Title:
TAB LEAD FRAME ASSEMBLY AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0368151
Kind Code:
A
Abstract:
PURPOSE: To improve reliability, yield, material efficiency and manufacturing efficiency by providing a plurality of patterned conductive elements for transmitting input and output signals to a bonding position, and varying its pitch. CONSTITUTION: A variable pitch tab lead frame assembly 103 has a plurality of similar segments 104. At first ends 110, 120 of a conductive element 107 for transmitting input and output signals, second ends 123 are connected to bonding pads 130 having a pitch P1 . A plurality of pads except the pads 130 are arrayed at different pitches from each other, and the end 123 of the element 107 is connected thereto.
Inventors:
TOOMASU JIEI DANAUEI
RICHIYAADO KEI SUPIRUBAAGAA
JIEIMUSU EMU POPURETSUTO
RICHIYAADO KEI SUPIRUBAAGAA
JIEIMUSU EMU POPURETSUTO
Application Number:
JP10322090A
Publication Date:
March 25, 1991
Filing Date:
April 20, 1990
Export Citation:
Assignee:
HONEYWELL INC
International Classes:
H01L21/60; H01L23/495; H05K3/34; (IPC1-7): H01L21/60
Domestic Patent References:
| JP61131850B |
Attorney, Agent or Firm:
Hiroo Kurokawa (1 outside)
Next Patent: TEST HEAD OF SEMICONDUCTOR TEST DEVICE