Title:
TAB TAPE AND BGA SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP3482900
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent short circuit caused by uncertain disconnection of a lead by a method, wherein wiring leads are disconnected from a feed line by a slit 5, and the inner leads are electrically separated from each other.
SOLUTION: Wiring leads 3 and a feed line 4 are disconnected from each other by a slit 5, which is provided crossing the wiring leads 3 after a wiring pattern is plated with Au in a TAB tape manufacturing process. In other words, the outline of a semiconductor device formed by the slit 5, which disconnects the wiring leads 3 from the feed line 4 after electroplating is so determined as to be located between the wiring leads 3 and the feed line 4, and the inner leads 3a are electrically separated from each other by the slit 5. That is, the wiring pattern 3 is arranged on the surface region of the tape base 10, so that the feed line 4 does not exist on a region where a semiconductor chip 2 is mounted.
More Like This:
Inventors:
Takumi Sato
Norio Okabe
Norio Okabe
Application Number:
JP3939699A
Publication Date:
January 06, 2004
Filing Date:
February 18, 1999
Export Citation:
Assignee:
Hitachi Cable Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP7321157A | ||||
| JP60154536A | ||||
| JP8293529A | ||||
| JP922925A | ||||
| JP499542U |
Other References:
【文献】国際公開98/018162(WO,A1)