PURPOSE: To provide a tablet forming mold for semiconductor resin sealing material having excellent abrasion resistance and mold release property, with which a molded piece of high quality having a processed face with preferable surface roughness can be obtained.
CONSTITUTION: A part of a mold which is in contact at least with a material is made of sintered diamond layers 19, 26, and 28 having thickness of 1-10mm. The sintered diamond layers are connected to a ground base material consisting of WC group ultrahard alloy. A lattice constant of bond phase of the WC group ultrahard alloy is set to 3.57 or less and an average grain diameter of the diamond is set to 0.2-50μm For the sintered diamond layer, a material containing 0.1-20% of one or more kinds of components to be selected from group IVa, Va, VIa elements in the periodic table and group of carbide, nitride, oxide, boride, Fe, Co, Ni of the above elements is used.
TERADA OSAMU
DAIMATSU KENITSUROU
