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Title:
テープ貼着方法及びテープ貼着装置
Document Type and Number:
Japanese Patent JP7143016
Kind Code:
B2
Abstract:
To provide a tape adhesion method capable of suppressing extension of an adhesive tape.SOLUTION: A tape adhesion method of peeling a circular adhesive tape from a peeling sheet and adhering the adhesive tape which is made of an adhesive layer and a base material, and in which the adhesive layer is adhered on a front surface of a peeling sheet, comprises: an adhesive tape preparing step of exposing the adhesive tape adhered onto the front surface of the peeling sheet by supporting a back surface side of the peeling sheet; an adhesive tape take-up step of rolling a replacement roller having a larger diameter than the adhesive tape of the width and the length of an outer periphery, and a function for sucking a base material side of the adhesive tape in an outer peripheral surface so as to contact with the base material, and taking-up the adhesive tape by sucking it to the outer peripheral surface of the replacement roller while peeling it from the peeling sheet; and an adhesive step of rolling the replacement roller so as to contact with a processed material held by a chuck table, and adhering the adhesive tape which is sucked to the outer peripheral surface of the replacement roller, and in which the adhesive layer is exposed with pressure, and adhering it.SELECTED DRAWING: Figure 1

Inventors:
Atsushi Inoue
Application Number:
JP2018068907A
Publication Date:
September 28, 2022
Filing Date:
March 30, 2018
Export Citation:
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Assignee:
Disco Co., Ltd.
International Classes:
H01L21/683; H01L21/301
Domestic Patent References:
JP2016111055A
JP2011129807A
JP2006339607A
JP2010073955A
JP2017059581A
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara