Title:
TAPE BALL GRID ARRAY PACKAGE EQUIPPED WITH ELECTROMAGNETIC INTERFERENCE PROTECTION, AND MANUFACTURING METHOD FOR THE PACKAGE
Document Type and Number:
Japanese Patent JP2006080531
Kind Code:
A
Abstract:
To provide a tape ball grid array (TBGA) package accompanied by an EMI protection and a method for manufacturing this TBGA package.
The TBGA package has a conductive support structure (a conductive reinforcement material) 106, an integrated circuit chip 102 installed on the conductive support structure 106, and a substrate 108 installed on a conductive support structure 106, wherein the substrate 108 includes patterned metal layers 122 and 124 electrically connected to the integrated circuit chip 102 and a dielectric layer 126, having a direct electrical connection (e.g., wire bonds 138, 140, 142, and 144) between the conductive support structure 106 and the patterned metal layers 122 and 124.
Inventors:
MU JINGHUI
Application Number:
JP2005261992A
Publication Date:
March 23, 2006
Filing Date:
September 09, 2005
Export Citation:
Assignee:
AGILENT TECHNOLOGIES INC
International Classes:
H01L23/00; H01L21/48; H01L23/047; H01L23/12; H01L23/13; H01L23/498; H01L23/552
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Arihara Koichi
Matsushima Tetsuo