To provide a tape bonding device capable of removing the slack of a placing means for placing a work, bonding a tape member to the work much more favorably, exfoliating the tape member easily, preventing dust from sticking to the work, and also preventing the work from deviating at the time of vacuum suction.

The tape bonding device for bonding the tape member to the work comprises a placing means for placing the work, a vacuum room which can be blockaded in an internally sealed state while making inherent the placing means and the work placed in the placing means, a moving device for moving the placing means toward the normal line direction of the work, a tape support means for supporting the tape member at a position estranged in the normal line direction to the work, while being provided in the inside of the vacuum room, a suction means for carrying out the vacuum suction of the inside of the vacuum room, and further a positioning means for positioning the work which is brought into contact with the outer circumferential edge of the work in the inside of the vacuum room.